RIADI, R.M. Sugeng; TAUFIK, Deni; HARSYA PUTRA, Tegar. Analisis Defect Low Ply Bond Dengan Metode Define, Measure, Analyze, Improve, Control (Dmaic) Pada Produk Core Board Grade A di PT XYZ. INFOTEX: Jurnal Ilmiah Bidang Ilmu Teknik, [S. l.], v. 2, n. 1, p. 33–45, 2023. Disponível em: https://ojs.stttexmaco.ac.id/index.php/infotex/article/view/37. Acesso em: 19 apr. 2025.